ml6xx71 ld series laser diodes for motion sensor tlde-p1323 specifications are subject to change without notice . ( 1 / 5 ) ML60171C type name description mitsubishi ml6xx71 is a high-power, high- efficient semiconductor laser diode which provides emission wavelength of 827 nm and standard light output of 260mw. this ld has narrow-stripe structure which enables better beam quality even at high output power. features application ? high output power: 260mw (cw) ? high efficiency: 1.0mw/ma (typ.) ? peak wavelength: 827nm (typ.) ? lateral single-mode lasing ? 5.6mm to-can pkg (with monitor pd) ? motion sensor ? printing absolute maximum ratings (note 1) v 2 - reverse voltage (pd) vrd v 2 - reverse voltage (ld) vrl c -40 ~ +75 - storage temperature tstg c 0 ~ +60 - case temperature tc mw 260 cw light output power po unit ratings conditions parameter symbol note1: the maximum rating means the limitation over which the laser should not be operated even instan t time. this does not mean the guarantee of its lifetime. a s for the reliability, please refer to the reliabil ity report issued by quality assurance section, hf & optical semicond uctor division, mitsubishi electric corporation. electrical/optical characteristics (tc=25 c) 20 16 12 cw, po=260mw beam divergence angle (perpendicular) q ^ ma 2.0 0.8 0.2 cw, po=260mw monitoring output current (photodiode) im 11 8.5 6 cw, po=260mw beam divergence angle (parallel) q // nm 840 827 820 cw, po=260mw peak wavelength l p mw/ma 1.15 1.00 0.85 cw, po=260mw slope efficiency h v 2.9 2.5 2.1 cw, po=260mw operating voltage vop ma 350 300 250 cw, po=260mw operating current iop ma 60 45 30 cw threshold current ith unit max typ. min. test conditions parameter symbol
ml6xx71 ld series laser diodes for motion sensor tlde-p1323 specifications are subject to change without notice . ( 2 / 5 ) outline drawings ML60171C ML60171C ? 5.6mm 0.4 +0.1 -0 90 2.0 0.3 (p. c. d. ) 0.4 +0.1 -0 1.6 0.1 3.55 0.1 4.4 +0 -0.03 5.6 3- 0.45 0.1 7.0 1.2 0.1 2.3 0.3 1.4 0.25 0.03 x (glass) 1 (1) (2)(3) reference plane 0.08 1.0 0.1 2 dimensions in mm +0.2 -0.3 0.2 0.08 0.4max 1.2max 3.8 pd (2) (3) case ld (1)
ml6xx71 ld series laser diodes for motion sensor tlde-p1323 specifications are subject to change without notice . ( 3 / 5 ) 0 50 100 150 200 250 300 0 100 200 300 400 current (ma) light output power (mw) cw 15 25 40 60 810 815 820 825 830 835 840 0 20 40 60 80 temperature ( ) peak wavelength (nm) po=260mw cw 0.23nm/ light output power vs. current (cw) peak wavelength vs. light output power peak wavelength vs. temperature far-field-patterns typical characteristics of ML60171C 810 815 820 825 830 835 840 0 50 100 150 200 250 300 light output power (mw) peak wavelength (nm) tc=25 cw 0.026nm/mw -50 -40 -30 -20 -10 0 10 20 30 40 50 angle () intensity (a.u.) po=260mw cw ? =16 =8.5
ml6xx71 ld series laser diodes for motion sensor tlde-p1323 specifications are subject to change without notice . ( 4 / 5 ) safety precaution for handling optical semiconducto r devices general: although manufacturer is always striving to improve the reliability of its products, problems and erro rs may occur with semiconductor devices. hence, it is necessary that users own products are designed with full regard t o safety by incorporating redundancy, fire prevention, and erro r prevention, so any problems or errors with semicon ductor device do not cause accidents, which might result in injur y, death, fire, or environmental hazard. the follow ing requirements must be strictly observed. warning! 1. safety standard of laser devices please follow closely to international standard (e. g. iec 60825-1) or standard of each country (ex. ji s c 6802 in japan). 2. laser characteristics and its danger when laser device is operated at over-driven condit ion, low temperature, pulsing mode, and so on, it c ould emit higher optical power than absolute maximum rating, and peak optical power might increase in conjunctio n with relaxation oscillation. laser device could lase at d ifferent wavelength with different case temperature , or different output power. laser devices are deviated on thresho ld current, operating current, operating voltage, s lope efficiency, peak wavelength, beam divergence, and so on. not on ly light output power, but also polarization or far field patterns might change as operating time goes by. if customer s need more information of laser device, please con tact mitsubishi electric. laser light from each device might seriously injure human eyes and skin. customer should design and ma nufacture carefully their application products based on not o nly laser light characteristics but also ld charact eristics, in order to avoid human injury. mitsubishi electric is not resp onsible for any accidents that are caused by custom ers products. if customers plan to release medical or aesthetic p roducts with laser device, they should obtain their governments laser safety authorization. 3. avoid laser light from entering human eyes in normal operation, semiconductor laser device emi ts laser light. laser light entering eyes could cau se extreme damage. never look against laser beam direction, an d never look directly through an optical system suc h as a lens. use an itv camera to observe laser light. mitsubish i electric recommends that customers should explici tly label their laser products with warning sign of eye injury. 4. handling of device gallium arsenide (gaas) is used in laser device. to avoid danger, strictly observe the following cautio ns: never place the device in human mouth. never burn o r break the device. never use any type of chemical treatment to reduce it to gas or powder. when disposing device, always follow any applicable laws, as well as custom ers internal waste treatment regulations. 5. disposal of device laser device uses gallium arsenide (gaas). it shoul d be disposed as a specially controlled industrial waste, and it should be separated from general industrial and hou sehold wastes, according to any law of wastes and cleaning. caution! 1. high temperature during operation device may become hot, therefore d o not directly touch it during operation. the devic e could remain hot even after power is turned off, so wait until i t cools down prior to touching to avoid any burn. n ever place any inflammable substance that may cause fire near the device.
ml6xx71 ld series laser diodes for motion sensor tlde-p1323 specifications are subject to change without notice . ( 5 / 5 ) handling cautions for optoelectronic devices 1. general (1-1) the products described in this specification are designed and manufactured for use in general com munication systems or electronic devices, unless their applica tions or reliability are otherwise specified. there fore, they are not designed or manufactured for installation in device s or systems that may affect human life or that are used in social infrastructure requiring high reliability. (1-2) when the customer is considering to use the p roducts described in this specification in special applications, such as transportation systems (automobiles, trains, ves sels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact mits ubishi electric or an authorized distributor. 2. storage conditions when storing the products, it is recommended to sto re them following the conditions described below wi thout opening the packing. not taking enough care in storing may result in defects in electrical characteristics, so ldering quality, visual appearance, and so on. the main points are describe d below (if special storage conditions are given to the product in the specification sheet, they have priority over th e following general cautions): (2-1) appropriate temperature and humidity conditio ns, i.e., temperature range between 5 35 c, and humidity between 45 75 percent rh, should be maintained in storage loca tions. controlling the temperature and humidity within this range is particularly important in case of long-term storage for six months or more. (2-2) the atmosphere should be particularly free fr om toxic gases and dust. (2-3) do not apply any load on the product. (2-4) do not cut or bend the leads of the devices w hich are to be stored. this is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customers assembling process. (2-5) sudden change in temperature may cause conden sation in the product or packing, therefore, such l ocations should be avoided for storing. temperature in stora ge locations should be stable. (2-6) storage conditions for cap-less products shal l be stated separately because these products requi re stricter controls than package sealed products. 3. design conditions and environment under use (3-1) operation in excess of the absolute maximum r atings can cause permanent damage to the device. the customers are requested to design not to exceed those ratings even for a short time. (3-2) avoid use in locations where water or organic solvents adhere directly to the product, or where t here is any possibility of the generation of corrosive gas, exp losive gas, dust, salinity, or other troublesome co nditions. such environments will not only significantly lower the reliability, but also may lead to serious accidents . (3-3) contamination to cap window or ld emitting po int by volatile material, such as adhesive, may deg rade reliability. when a customer use adhesive material, we recommend the customer to confirm possible effect before usag e. (3-4) quality assurance for cap-less products shall be stated separately because these products requir e more notice in your line and your products environment than packag e sealed products. 4. static electric safety cautions the optoelectronic devices are sensitive to static electricity (esd, electro-static discharge). the pr oduct can be broken by esd. when handling this product, please observe the following countermeasures: to prevent break of devices by static electricity o r surge, please adopt the following countermeasures in the assembly line: (4-1) ground all equipments, machinery jigs, and to ols in the process line with earth wires installed in them. take particular care with hot plates, solder irons and o ther items for which the commercial power supplies are prone to leakage. (4-2) workers should always use earth bands. use of antistatic clothing, electric conductive shoes, an d other safety equipment while at work is highly recommended. (4-3) use conductive materials for this products c ontainer, etc. (4-4) it is recommended that grounding mats be plac ed on the surfaces of assembly line workbench and t he surrounding floor in work area, etc. (4-5) when mounting this product in parts or materi als which can be electrically charged (printed wirin g boards, plastic products, etc.), pay close attention to the static electricity in those parts. esd may damage the prod uct. (4-6) humidity in working environment should be con trolled to be 40 percent rh or higher. these countermeasures are most general, and there i s a need to carefully confirm the line using this p roduct. it is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
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